Misc Links
Forum Archive
News Archive
File DB
 

Intel Beats AMD to Lead-Free Processors
Posted by newsbot on October 24th 2007



Now that the flip-chip bump solder points that used to contain lead have been replaced with a copper column and lead-free solder the pro cessors are more environmentally friendly, but this does come at a cost. The melting point of lead-tin is 183C, whereas the melting point of lead- free solders is greater than 220C. This means increased stress on the fli p-chip package and more power consumption since the convection ovens need their baking temperatures increased. To manage the increased stress and survive the higher process temperatures, Intel reengineered many parts of the processor...

View article at legitreviews.com



(Due to past abuse from spammers you must be a registered forum member to post comments, and must be logged in)


corner image

This site best viewed in a W3C standard browser at 800*600 or higher
Site design by Red Squirrel | Contact
© Copyright 2017 Ryan Auclair/IceTeks, All rights reserved